Interconnect system offers reliability and board space savings

TE Connectivity’s AMPMODU 1.0mm Centerline Interconnect System, available now from Mouser, provides an 85% space savings on the board compared to the standard 2.54mm pitch connectors. A dual beam contact design gives a reliable electrical connection even in severe shock/vibration environments. The system helps a wide range of design necessities with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.

The system offers manufacturing flexibility in an automated environment with surface mount configuration with pick and place cap. It provides improved durability and corrosion resistance with gold plating. The system is RoHS and REACH compliant.

The system is ideal for industrial controls, building and home automation devices, servo drives, PLC, I/O devices, telecommunication equipment, robotics, and instrumentation and test equipment applications.

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